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DATA SHEET
SILICON POWER TRANSISTOR
2SC3569
NPN SILICON TRIPLE DIFFUSED TRANSISTOR FOR HIGH-VOLTAGE HIGH-SPEED SWITCHING
The 2SC3569 is a mold power transistor developed for highvoltage high-speed switching, and is ideal for use in drivers such as switching regulators, DC/DC converters, and high-frequency power amplifiers.
PACKAGE DRAWING (UNIT: mm)
FEATURES
* Mold package that does not require an insulating board or insulation bushing * Low collector saturation voltage: VCE(sat) = 1.0 V MAX. (@ 0.7 A) * Fast switching speed: tf 1.0 s MAX. (@ 0.7 A) * Wide base reverse-bias SOA: VCEX(SUS) = 450 V MIN. (@ 0.5 A)
ABSOLUTE MAXIMUM RATINGS (Ta = 25C)
Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current (DC) Collector current (pulse) Base current (DC) Total power dissipation Total power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC(DC) IC(pulse)* IB(DC) PT (Tc = 25C) PT (Ta = 25C) Tj Tstg Ratings 500 400 7.0 2.0 4.0 1.0 15 2.0 150 -55 to +150 Unit V V V A A A W W C C
Electrode Connection 1. Base 2. Collector 3. Emitter
* PW 300 s, duty cycle 10%
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. D16187EJ1V0DS00 Date Published April 2002 N CP(K) Printed in Japan
(c)
2002 1998
2SC3569
ELECTRICAL CHARACTERISTICS (Ta = 25C)
Parameter Collector to emitter voltage Collector to emitter voltage Collector to emitter voltage Collector cutoff current Collector cutoff current Collector cutoff current Collector cutoff current Emitter cutoff current DC current gain DC current gain Collector saturation voltage Base saturation voltage Turn-on time Storage time Fall time Symbol VCEO(SUS) VCEX(SUS)1 VCEX(SUS)2 ICBO ICER ICEX1 ICEX2 IEBO hFE1* hFE2* VCE(sat)* VBE(sat)* ton tstg tf Conditions IC = 0.5 A, IB1 = 0.1 A, L = 1 mH IC = 0.5 A, IB1 = -IB2 = 0.1 A, L = 180 H, clamped IC = 1.0 A, IB1 = 0.2 A, -IB2 = 0.1 A, L = 180 H, clamped VCB = 400 V, IE = 0 VCE = 400 V, RBE = 51 , Ta = 125C VCE = 400 V, VBE(OFF) = -1.5 V VCE = 400 V, VBE(OFF) = -1.5 V, Ta = 125C VEB = 5.0 V, IC = 0 VCE = 5.0 V, IC = 0.2 A VCE = 5.0 V, IC = 0.5 A IC = 0.7 A, IB = 0.14 A IC = 0.7 A, IB = 0.14 A IC = 0.7 A, RL = 214 , IB1 = -IB2 = 0.14 A, VCC 150 V Refer to the test circuit. 20 10 1.0 1.2 1.0 2.5 1.0 V V MIN. 400 450 400 10 1.0 10 1.0 10 80 TYP. MAX. Unit V V V
A
mA
A
mA
A
s s s
* Pulse test PW 350 s, duty cycle 2%
hFE CLASSIFICATION
Marking HFE1 M 20 to 40 L 30 to 60 K 40 to 80
TYPICAL CHARACTERISTICS (Ta = 25C)
Total Power Dissipation PT (W)
Case Temperature TC (C)
Collector Current IC (mA)
Collector to Emitter Voltage VCE (V)
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Data Sheet D16187EJ1V0DS
2SC3569
Transient Thermal Resistance Rth(j-c) (C/W)
IC Derating dT (%)
Ta = 25C (without heatsink) (with infinite heatsink)
Case Temperature TC (C) Pulse Width PW (s)
Collector Current IC (A)
Collector to Emitter Voltage VCE (V)
Collector Current IC (A)
Collector to Emitter Voltage VCE (V)
Collector Current IC (mA)
Collector Saturation Voltage VCE(sat) (V) Base Saturation Voltage VBE(sat) (V)
DC Current Gain hFE
Collector Current IC (mA)
Data Sheet D16187EJ1V0DS
3
2SC3569
Turn-On Time ton (s) StorageTime tstg (s) Fall Time tf (s)
Collector Current IC (A)
Base current waveform
Collector current waveform
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Data Sheet D16187EJ1V0DS
2SC3569
[MEMO]
Data Sheet D16187EJ1V0DS
5
2SC3569
* The information in this document is current as of July, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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